Here it is, the S3X58-G801. A new high performance general application solder paste without restraints from reflow profile

With high balanced performance in void reduction and printability/wettability improvement forversatile application

• Reduces void occurrence regardless of component type or reflow profile
• Retains the print geometry, higher first pass yield
• Good wetting performance to a wide range of materials
• http://www.ko-ki.co.jp/en/products/solder_paste/g801_en.html

• http://www.ko-ki.co.jp/en/memo/memo_201704_en.html

Return to overview