News
Here it is, the S3X58-G801. A new high performance general application solder paste without restraints from reflow profile
With high balanced performance in void reduction and printability/wettability improvement forversatile application
- Reduces void occurrence regardless of component type or reflow profile
- Retains the print geometry, higher first pass yield
- Good wetting performance to a wide range of materials
- http://www.ko-ki.co.jp/en/products/solder_paste/g801_en.html
Setting the Printer parameters for fine-pitch printing?
